2009 - maintenantAdvanced Packaging 3D-IC area : - Identification of market trend, forum, publication- Support of prototype design & manufacturing accordingly to customer requirements- Collaborative work with CEA- LETI and ST Crolles factory
STMicroelectronics
- Process leader
2004 - 2009- Team management- Collaborative work with front end foundry and packaging plants- Industrialization of processes in ST production plants : (south east Asia)
